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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMLD6263
70V Surface mount Diode-Schottky (<1A) Dual: High Voltage: Same Polarity
The image for CMLD6263
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CPD51V-CMOD6263
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPD51V-1N6263-CM Active Bare die,11.800 X 11.800 mils,Diode-Schottky (<1A),High Voltage Schottky Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CPD51V-1N6263-CT Active Bare die,11.800 X 11.800 mils,Diode-Schottky (<1A),High Voltage Schottky Diode WafflePack@400 Please call for Qty
 EAR99 8541.10.0040  
CMLD6263 BK Discontinued , Stock Only 70V Surface mount Diode-Schottky (<1A) Dual: High Voltage: Same Polarity Box@5,000 None
 EAR99 8541.10.0070 63D 
Either
PBFREE
TIN/LEAD
CMLD6263 TR Discontinued , Stock Only 70V Surface mount Diode-Schottky (<1A) Dual: High Voltage: Same Polarity Reel@3,000 In Stock
 EAR99 8541.10.0070 63D 
Either
PBFREE
TIN/LEAD

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Halogen Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Spice Model:I-Spice Model CMLD6263
Spice Model:P-Spice Model CMLD6263
Material Composition:SOT-563
Process Change Notice:SOT-563 Alternate Lead Frame
Process Change Notice:Copper Wire Bonding - SOT-563
Package Detail Document:SOT-563
Product EOL Notice:SOT-563 OPTION2
Product Reliability Data:SOT-563 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMAD6263 		15mA,70V Surface mount Diode-Schottky (<1A) Single: High Voltage
Box, Reel
Active

CMDD6263 		70V Surface mount Diode-Schottky (<1A) Single: High Voltage
Box, Reel
Active

CMKD6263 		70V Surface mount Diode-Schottky (<1A) Triple: High Voltage
Box, Reel
Active

CMOD6263 		70V Surface mount Diode-Schottky (<1A) Single: High Voltage
Box, Reel
Active

CMPD6263 		70V Surface mount Diode-Schottky (<1A) Single: High Voltage
Box, Reel
Active

CMSD6263 		70V Surface mount Diode-Schottky (<1A) Single: High Voltage
Box, Reel
Active

CPD51V-1N6263 		Bare die,11.800 X 11.800 mils,Diode-Schottky (<1A),High Voltage Schottky Diode
WaferForm, WafflePack
Active

1N6263 		Through-Hole Diode-Schottky (<1A) Single
Box, Reel
Discontinued, Stock Only<br><a href="https://my.centralsemi.com/search/search2.php?searchtext=CMDD6263">Replaced by:CMDD6263</a>

None

 

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