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CMLDM7002A
Surface mount MOSFET Dual N-Channel Enhancement Mode
The image for CMLDM7002A
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP324X-CMLDM7002A
Chip Process Datasheet:CP324X-CMLDM7002A
Item Number Status Packaging Base Availability Part Marking: Request Samples
CMLDM7002A BK Active Box@5,000 Please call for Qty
 L02 
Either
PBFREE
TIN/LEAD
CMLDM7002A TR Active Reel@3,000 Please call for Qty
 L02 
Either
PBFREE
TIN/LEAD
CMLDM7002AG BK Active Box@5,000 In Stock
 C2G 
Either
PBFREE
TIN/LEAD
CMLDM7002AG TR Active Reel@3,000 In Stock
 C2G 
Either
PBFREE
TIN/LEAD
CP324X-2N7002A-CM Active WafflePack@400 Please call for Qty
  
CP324X-2N7002A-CT Active WafflePack@400 In Stock
  
CP324X-2N7002A-WN Active Wafer@34,700*
*Estimated, die qty will vary based on probing		 Please call for Qty
  
CP324X-7002A-CM200 Active WafflePack@200 In Stock
  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Leadframe
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Copper Bond Wire
Spice Model:Spice Model CMLDM7002A
Material Composition:SOT-563

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMPDM7002A 		Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CMXDM7002A 		Surface mount MOSFET Dual N-Channel Enhancement Mode
Box, Reel
Active

CP324X-2N7002A 		Chip Form: 21.650 X 21.650 N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

CP324X-7002A 		Chip Form: 21.650 X 21.650 N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

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