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manufacturer of innovative discrete semiconductor solutions
Central Semiconductor

CMXDM7002A
280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
CMXDM7002A product image
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Chip Process Datasheet:CP324X-CMLDM7002A
Chip Process Datasheet:CP324X-CMLDM7002A
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP324X-2N7002A-CM Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP324X-2N7002A-CT Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP324X-2N7002A-WN Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET Wafer@34,700*</br>*Estimated, die qty will vary based on probing In Stock
 EAR99 8541.21.0040  
CP324X-2N7002A-WR Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET Wafer@34,700*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  
CMXDM7002A BK Discontinued , Stock Only 280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode Box@3,500 None
 EAR99 8541.21.0080 X02A 
Either
PBFREE
TIN/LEAD
CMXDM7002A TR Discontinued , Stock Only 280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode Reel@3,000 None
 EAR99 8541.21.0080 X02A 
Either
PBFREE
TIN/LEAD
CP324X-7002A-CM200 Special Order Item Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET WafflePack@200 In Stock
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Sn Plating
Analytical Test Report:Leadframe
Analytical Test Report:Gold Bond Wire
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Sn Plating
Analytical Test Report:Green Epoxy Molding Compound
Analytical Test Report:Leadframe
Analytical Test Report:Henkel 84-1LMISR4
Material Composition:SOT-26
Package Detail Document:SOT-26
Product EOL Notice:certain SOT-26 PRODUCTS
Product Reliability Data:SOT-26 Package Reliability

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMLDM7002A 		280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
Box, Reel
Replaced by Halogen Free Version:CMLDM7002AG

CMLDM7002AG 		280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
Box, Reel
Active

CMPDM7002A 		280mA,60V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Replaced by Halogen Free Version:CMPDM7002AG

CMPDM7002AG 		280mA,60V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CP324X-2N7002A 		Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Active

CP324X-7002A 		Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Special Order Item

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