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Central Semiconductor

CP324X-2N7002A
Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET
The image for CP324X-2N7002A
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CP324X-H2N7002A-CM Active Up-Screened Bare Die MIL-PRF-38534 Class H Equivalent,21.650 X 21.650 mils,Bare Die,N-Chan Enhancement Mode MOSFET WafflePack@400 In Stock
 EAR99 8541.21.0040  
CP324X-2N7002A-CM Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP324X-2N7002A-CT Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET WafflePack@400 Please call for Qty
 EAR99 8541.21.0040  
CP324X-2N7002A-WN Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET Wafer@34,700*</br>*Estimated, die qty will vary based on probing In Stock
 EAR99 8541.21.0040  
CP324X-2N7002A-WR Active Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET Wafer@34,700*</br>*Estimated, die qty will vary based on probing Please call for Qty
 EAR99 8541.21.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Schottky
Analytical Test Report:Active Device, Rectifier
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Analytical Test Report:Die
Spice Model:Spice Model CP324X
Package Detail Document:WAFER
Analytical Test Report:Wafer Zener
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer MOSFET
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die
Analytical Test Report:Die

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMLDM7002A 		280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
Box, Reel
Replaced by Halogen Free Version:CMLDM7002AG

CMLDM7002AG 		280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
Box, Reel
Active

CMPDM7002A 		280mA,60V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Replaced by Halogen Free Version:CMPDM7002AG

CMPDM7002AG 		280mA,60V Surface mount MOSFET N-Channel Enhancement Mode
Box, Reel
Active

CMXDM7002A 		280mA,60V Surface mount MOSFET Dual N-Channel Enhancement Mode
Box, Reel
Discontinued, Stock Only

None

 

CP324X-7002A 		Bare die,21.650 X 21.650 mils,N-Chan Enhancement Mode MOSFET
WaferForm, WafflePack
Special Order Item

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