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Central Semiconductor

CPD64-CMPD3003
200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
The image for CPD64-CMPD3003
is currently unavailable.
Please refer to the Device Datasheet for an image of the part case and material composition information.
Documentation Links:
Device Datasheet
Case & Material Composition Datasheet
Item Number Status Description Packaging Base Availability ECCN Code HTS Code Part Marking: Request Samples
CPD66X-CMPD3003-CT Active 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage WafflePack@400 Please call for Qty
Replaces CPD64-CMPD3003-CT 		EAR99 8541.10.0040  
CPD66X-CMPD3003-WN Active 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage Wafer@34,368*</br>*Estimated, die qty will vary based on probing Please call for Qty
Replaces CPD64-CMPD3003-WN 		EAR99 8541.10.0040  
CPD64-CMPD3003-CT Discontinued , Stock Only 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage WafflePack@400 Replaced by CPD66X-CMPD3003-CT
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  
CPD64-CMPD3003-WN Discontinued , Stock Only 200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage Wafer@34,368*</br>*Estimated, die qty will vary based on probing Replaced by CPD66X-CMPD3003-WN
Exact Electrical Equivalent, Slight Mechanical Differences 		EAR99 8541.10.0040  

Please note:
  1. If requesting Tin/Lead plated devices, add the suffix " TIN/LEAD" to the part number when ordering (example: 2N2222A TIN/LEAD).
  2. If requesting Lead (Pb) Free plated devices, add the suffix " PBFREE" to the part number when ordering (example: 2N2222A PBFREE).
A Central sales representative will confirm the availability of the plating type requested.

Additional Documentation Links:
Analytical Test Report:Wafer Transistor
Analytical Test Report:Wafer Schottky
Analytical Test Report:Wafer Switching Diode
Analytical Test Report:Die
Analytical Test Report:Die
Spice Model:Spice Model CPD64
Process Change Notice:CPD64 REPLACED WITH CPD66X
Package Detail Document:WAFER
Product EOL Notice:BLANKET PDN-BARE DIE PRODUCTS
Analytical Test Report:Wafer Rectifier
Analytical Test Report:Wafer
Analytical Test Report:TVS Die
Analytical Test Report:Wafer/Die
Analytical Test Report:Die

Alternate Devices with Different Packaging:
Datasheet
Part Number
Description
Packaging
Package
Details &
Composition
Status
Availability

CMDD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CMOD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CMPD3003 		200mA,200V Surface mount Diode-Low Leakage Single
Box, Reel
Active

CPD66X-CMPD3003 		200mA,200V Bare die,17.500 X 17.500 mils,Diode-Low Leakage
WaferForm, WafflePack
Active

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